Isophorone Diamine (IPDA) | CAS 2855-13-2 | Aliphatic Amine Curing Agent

🧪 1. Epoxy Resin Curing Agent

This is the primary application field of IPDA, accounting for the majority of its consumption.

• Use: As a curing agent in two-component epoxy systems.

• Characteristics:

  • Moderate curing speed (faster than aliphatic, slower than aromatic amines)

  • Cured products have high transparency and excellent non-yellowing properties

  • Good chemical resistance, mechanical strength, and toughness

  • High heat distortion temperature; suitable for room-temperature or medium-temperature curing

• Typical Applications:

  • Floor coatings, solvent-free coatings

  • Adhesives and casting compounds

  • Electronic encapsulation materials

  • Composites (e.g., wind turbine blades, carbon-fiber parts)

🧴 2. Polyurethane (PU) and Polyurea Systems

IPDA serves as a chain extender or crosslinker, especially in aliphatic or cycloaliphatic isocyanate systems.

• Use: Reacts with HDI or IPDI to form highly transparent, weather-resistant PU or polyurea.

• Advantages:

  • Improves mechanical strength, heat resistance, and chemical resistance

  • Enhances flexibility and adhesion

  • Suitable for high-solids polyurethane dispersions (PUDs), improving drying speed and transparency (though excessive amounts may cause turbidity or phase separation)

• Applications:

  • Non-yellowing polyurethane coatings

  • Elastomers, sealants, inks

  • Waterborne PUD resin synthesis for high-performance industrial coatings

🧰 3. Intermediate for Chemical Synthesis

IPDA is a key intermediate in the manufacture of high-performance materials.

• Derivatives:

  • Isophorone diisocyanate (IPDI) – obtained by oxidation or photochlorination; a premium cycloaliphatic diisocyanate monomer

  • Urethane and amide derivatives – used in specialty polymers

  • Amine-terminated resins – for modifying epoxy, phenolic, and polyester systems

🧫 4. Other Applications

• Anti-corrosion coatings – for bridges, marine facilities, and steel structures

• Electrical and electronic insulation materials – due to low moisture absorption and excellent dielectric properties

• Composites – as an epoxy curing agent for high-strength fiberglass systems

• Structural adhesives – suitable for bonding metals, concrete, and composites